TE Connectivity high-density aircraft modules enhance pin protection

TE Connectivity Ltd., provider of connectivity and sensors, is introducing its DMC-M high-density 30-23 modules for aerospace applications, including next-generation aircraft (stealth also) and UAV’s.

The company understands the challenges that next-generation aircraft design poses. They focused on continually developing new designs that save space and weight. According to Christian Cavailles, Product Manager, Global Aerospace, Defense & Marine, TE. “Not only have the new inserts been designed to solve the issue of fragile contact pins being bent upon blind mating, but out of the full product line they provide the highest density system in an extremely small area.”

The high-density modules are ideal for applications such as: in-flight entertainment and cabin systems, high-speed Internet access, lighting and window dimming, power distribution and control, and electrical wiring and interconnect systems. Also TE’s plastic clip technology provides additional weight savings and simplifies the assembly process, providing possible weight savings of up to 20 percent – what obviously lead to lower aircraft production and maintenance costs.

Author: Daniel Kasprzycki
Photo: The DMC-M 30-23 Inserts produced by TE Connectivity Ltd.
Source: www.intelligent-aerospace.com

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